Products

Soldermask, Ident and Hole Filling Products

THP-100DX1
	Single-Component Thermal Cure Hole Fill Material "SP" Version for Screen Print and "VF" Version for Machine Filling (Mass, ITC, etc.) Available in Air-Free Cartridges for Automatic Equipment or Standard Containers High Tg (160°C) Low CTE (32/115 ppm) Very Low Shrinkage Easy Planarization No Chemical Attack through Desmear Low Halogen and RoHS Compliant High PCT and Thermal Resistance

SCHP-7901
	Silver Conductive Hole Fill Material Single-Component Thermally Cured Good Reliability Compatible with Copper Plating Excellent Thermal Conductivity RoHS Compliant Low Halogen

UVHP-100
	UV Cure, One-Component Hole Fill Material For Plated or Non-Plated Holes Very Low Shrinkage Compatible with Solder Mask Top Coat RoHS Compliant Low Halogen