PRODUCTS

Release Film

Laminating Release Film
	Engineered for the Specific Purpose of Printed Circuit Lamination Excellent Thermal Properties Matt Finish Thickness 0.025mm (0.001”) Thickness 0.038mm (0.0015”) Available on Request Widths 14” to 28” in 2” increments, plus 36”, 38”, 39”, 40”, and 48”
	LAMAR_Acculam_Laminating-Release-Film-data
	LAMAR_Acculam_Laminating-Release-Film-msds

High Temperature Release Film
	Ultra Flat, High Performance Release Film Temperatures up to 260 degrees Centigrade Suitable for Bonding Polyimide and All High Temperature Bonding Applications Easy to Handle Low Shrinkage Easy Release from all Surfaces No Contamination on Press Plates or Copper Available in Film Thicknesses 0.025mm, 0.50mm and 0.125mm Widths Available from 355mm
	LAMAR_High_Temperature-Release-Film-data
	On Request