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COPPER FOIL PRODUCTS
RELEASE FILM
THERMAL CONTROL MATERIALS
PRODUCTS
Laminates & Prepregs
Thermally Conductive
Chin Shi Insulated Conductive Metal Circuit Board
Wide Range of Substrate Thickness and Copper Cladding Available
Thermal Conductivity Ranging from 2W/mC to 9W/Mc
Rigid and Multi-layer Laminates
Prepreg and RCC Foil
Wide range of Panel and Sheet Sizes
Data Sheet available on request / MSDS available on request
Denka HITT PLATE - Insulated Thermally Conductive Metal Circuit Board
High Thermal Conductivity
Type K-I 2W/MK
Type TH-I 4W/MK
Excellent Heat Shock Resistance
Excellent Moisture Resistance
UL 94 V-0
LAMAR_Denka_HITT-Plate-intro.pdf
LAMAR_Denka_HITT-Plate-data.pdf